Step 1: A square shaped piece is being cut out from a single-layered copperplate PCB.

Step 2: The copper surface is being cleaned with Acetone and, if necessary, with sand paper.

Step 3: Using a special oil-based PCB marker, the layout is being drawn on the board. For the SMD components, special care and precision is required because here, hardly any tolerances in width and distance of the contact areas may occur. If lines touch accidentally, the color is being scratched off with a needle.

Step 4: The holes for the components and cable connections are being center-punched with a special tool. The punching marks are being filled up with color afterwards.

Step 5: After a short period of drying, the board is being put into an etching bath, consisting of warm water and Ferrum-3-Chloride (FeCl3), in a mixture of approx. 1:1. If necessary, some more Ferrum-3-Chloride is being added.

Step 6: The board is being removed from the acid bath after approx. 20 minutes. If there are no visible copper residues on the unmarked surface, the board can be dried off.

Step 7: The color is being removed with Acetone. Just to be sure, the uncovered areas are being checked for electric non-conductivity. If there is conductivity, this area has to be cleaned with a needle or a razor-blade. Also, the covered areas are checked for conductivity.

Step 8: The surface is being covered with a mixture of flux and Acetone. It will make the soldering process easier and will be a protective layer against oxidation.

Step 10: Soldering.